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XCVM1502-2MSEVFVC1760
  • image of System On Chip (SoC)>XCVM1502-2MSEVFVC1760
  • image of System On Chip (SoC)>XCVM1502-2MSEVFVC1760
Part number XCVM1502-2MSEVFVC1760
Product classification System On Chip (SoC)
Manufacturer Xilinx (AMD)
Type IC VERSALPRIME
Encapsulation -
Packing Tray
Quantity 0
RoHS 1
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$9,951.0000

$9,951.0000

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image of System On Chip (SoC)>XCVM1502-2MSEVFVC1760
image of System On Chip (SoC)>XCVM1502-2MSEVFVC1760
Part number
XCVM1502-2MSEVFVC1760
Product classification
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
IC VERSALPRIME
-
Tray
0
Product parameters
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TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1760-BFBGA, FCBGA
Speed600MHz, 1.4GHz
RAM Size256KB
Number of I/O500
Operating Temperature0°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA
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